SUSS MicroTec , a leading supplier of precision manufacturing and test equipment for the semiconductor and related markets, announced today the launch of the company's next generation, ground breaking wafer bonding technology. Called the ELAN CB8, it is based on an entirely new design platform and is capable of achieving "be…

http://www.sichinamag.comhttp://article.sichinamag.com/2007-05/2007510114859.htm -- 2007-5-10 0:00:00

Silicon Genesis Corporation (SiGen) announced today that it has developed the process modifications to manufacture direct silicon bonded substrates. Direct silicon bond (DSB) substrates are fabricated by bonding and electrically attaching a film of single-crystal silicon of differing crystal orientation onto a base substrate. As oppos…

http://www.sichinamag.comhttp://article.sichinamag.com/2006-04/2006420044125.htm -- 2006-4-20 0:00:00

当前IC产业继续按照摩尔定律发展所面临的最大挑战之一就是互连问题。在量产的集成电子产品中，使用了铜/低k互连技术的平面CMOS IC工艺继续缩小尺寸。但当特征尺寸缩小到45 nm技术节点以下时，预计其成本将非常高而且工艺操作非常困难。即便采用…

http://www.sichinamag.comhttp://article.sichinamag.com/2005-12/20051229015806.htm -- 2005-12-29 0:00:00

　　摘要：在简要回顾了现行的3-D互连技术流程之后，本文主要探讨了使用对准晶圆键合技术的晶圆级3-D集成问题。讨论的重点集中在晶圆粘结键合技术以及目前该项技术已经取得的成果上。 　　当前IC产业继续按照摩尔定律发展所面临的最大挑战之一就…

http://www.sichinamag.comhttp://article.sichinamag.com/2005-10/20061121430533b944.htm -- 2005-10-10 0:00:00