| 演讲 |
演讲人介绍 |
韩瑞津
扩散&CMP 部门经理
GSMC (宏力半导体)
|
韩瑞津博士1992年在马里兰大学College Park分校化学工程学院获得博士学位。之后，作为博士后在Research
Triangle Park, NC.的CIIT进行了为期三年的呼吸病毒学研究。他曾在St. Peter, MO
MEMC的技术研发部门，负责200mm晶园清洗槽的设计，工艺研发和全球推广。2000年，韩博士加入位于Santa
Clara, CA 的Intel D2，负责P858/P803的工艺持续改善和P860/P804/P805/P848/P893/P894铜湿洗的研发。目前，他担任GSMC
Diffusion & CMP的部门经理，负责技术转移和所有产品包括铜工艺线的研发。 |
Manny Gonzales
Applications Engineer, Poco Graphite, Inc-USA.
Simon Shen
Applications Engineer, Poco Graphite, Inc.-Shanghai
Rep. Office
|
Mr.Gonzales background
is Process Development and Process Engineering in both R&D
and Manufacturing Fab environments.
Mr.Shen has an extensive background in graphite technology
and applications support.
|
Rajan Rajgopal
Chartered Semiconductor |
Director, Process Integration & Defect Density Chartered
Semiconductor |
Victor
Gill
KLA-Tencor Corporation |
Victor Gill is Vice President, Business Development at
KLA-Tencor Corporation. His 12-year career with the company
also includes roles in applications engineering, product
marketing, and internal sales. Mr. Gill has expertise in
device process engineering, and has spoken extensively on
the advantages of inline defect reduction. |
王立 Wang Li
产品处/ FA 经理
Product Div./ Product FA Dep. Manager
SMIC(中芯国际)
|
1995年毕业于台湾淡江物研所，1997开始从事半导体方面的工作，在SRAM 和Logic产品方面有8年的经验，现担任中芯国际产品处/
FA 经理。 |
Dr. Charles Lin
FSI |
Dr. Charles Lin is Director of Product Management for
FSI International, Asia. He joined FSI in 2003. Prior to
joining FSI, Dr. Lin worked for both Winbond Electronic
Corp. (1991-2000) and Suntek Semiconductor Corp. (2000-2003).
He received his Ph.D. and master degree in Materials Sci.
& Eng. and MBA degree in Management of Technology all
from the National Chiao-Tung University in Taiwan. He currently
holds 13 U.S. patents, 18 Taiwan patents and has authored
or co-authored over 40 papers on semiconductor process engineering. |
李文强 Li Wenqiang
TD刻蚀部主任 (R&D Director)
HH NEC(华虹NEC)
|
2004年4月担任华虹NEC TD刻蚀部主任，1995年开始在Wafertech
LLC, USA 担任工程师，之后在新加坡特许担任主任工程师 |
Professor Min Zhang
SMIF |
Professor Min Zhang
Professional Experience in Microelectronics
Shanghai Institute of Metallurgy, Chinese Academy of Sciences,
since 1958. SIM has changed to the name Shanghai Institute
of Micro-system and Information Technology in 2003 according
to its long period existing research fields.
Professor, PhD supervisor, since 1985, retired at 2002;
Deputy Director of SIM, CAS, 7/87 to 6/97;
Vice President, Shanghai Microelectronics Research &
Development Center, 7/88 to 7/97;
Chief Executive Officer, Shanghai Microelectronics National
Engineering Research Center, 7/91-7/98;
National Research and Resource Facilities for Submicron
Structure, Cornell University, Ithaca, NY, USA;
The 7th, 8th National People Congress of China 3/88-3/98
People Representative; |
孙岳懋(James Sun)
产品工程部经理
TSMC(台积电)
|
台湾国立交通大学电机工程系学士，作为工艺工程师，在台积电有6年6寸和12寸晶圆制造的经验。四年产品工程师和经理的经验。负责多种技术、不同产品（从0.50um
到0.15um ）和北美、日本、欧洲和亚洲的客户服务。 |
