| A/D |
analog to digital |
| AA |
atomic absorption |
| AAS |
atomic absorption spectroscopy |
| ABC |
activity-based costing |
| ABM |
activity-based management |
| AC |
alternating current; activated carbon |
| ACF |
anisotropic conductive film |
| ACI |
after-clean inspection |
| ACP |
anisotropic conductive paste |
| ACT |
alternative control techniques; actual cycle time |
| ADC |
analog-to-digital converter |
| ADE |
advanced development environment |
| ADI |
after-develop inspection |
| ADT |
applied diagnostic technique |
| ADTSEM |
Apply/Develop Track Specific Equipment Model |
| AE |
atomic emission; acousticemission; absolute ellipsometry |
| AEC |
advanced equipment controller |
| AECS |
Advanced Equipment ControlSystem; Automated Equipment Control System |
| AEI |
after-etch inspection; automated equipment interface |
| AEM |
analytical electron microscopy |
| AES |
Auger emission/electron spectroscopy |
| AFM |
atomic force microscopy |
| AFP |
abrasive-free polish |
| Ag |
silver |
| A-GEMTF |
Advanced GEM Task Force |
| AGV |
automated guided vehicle |
| AHF |
anhydrous hydrogen fluoride |
| AHU |
air handling unit |
| AIR |
automated image retrieval |
| Al |
aluminum |
| ALD |
atomic layer deposition |
| ALE |
atomic layer epitaxy; application logic element |
| ALS |
advanced light source; advanced low-power Schottky |
| AMC |
airborne molecular contamination |
| AMHS |
automated material handling system |
| AMT |
advanced manufacturing technology |
| AMU |
atomic mass unit |
| ANN |
artificial neural network |
| ANOVA |
analysis of variance |
| AOV |
air-operated valve |
| AP |
adhesion promoter |
| APA |
advanced performance algorithm |
| APC |
advanced process control |
| APCD |
add-on pollution control device |
| APCFI |
Advanced Process Control Framework Initiative |
| APCVD |
atmospheric pressure chemical vapor deposition |
| APEC |
advanced process equipment control |
| API |
application programming interface; atmospheric pressure ionization |
| APM |
atmospheric passivation module; acoustic plate mode |
| APRDL |
Advanced Products Research and Development Laboratory |
| aPSM |
attenuating phase-shift mask |
| AQI |
ACCESS query interface |
| AQL |
acceptable quality level |
| Ar |
argon |
| AR |
aspect ratio |
| ARAMS |
Automated Reliability |
| ARC |
antireflective coating |
| ARDE |
aspect ratio-dependent etching |
| ARPA |
Advanced Research Projects Agency (see DARPA) |
| ARS |
angle-resolved scattering |
| As |
arsenic |
| AS/RS |
automated storage and retrieval system |
| ASAP |
Advanced Stepper Application Program |
| ASIC |
application-specific integrated circuit |
| ASO |
automatic shutoff |
| ASP |
advanced strip and passivation; advanced strip processor |
| ASR |
automated send receive |
| ATDF |
Advanced ToolDevelopment Facility |
| ATE |
automatic test equipment |
| ATG |
automatic test generation |
| ATLAS |
abbreviated test language for all systems |
| atm |
atmosphere |
| ATP |
advanced technology program; adenosine triphosphate; acceptance and tool performance |
| ATR |
attenuated total reflectance |
| Att |
attenuated |
| Au |
gold |
| AVP |
advanced vertical processor |
| AVS |
advanced visualization system |
| AWE |
asymptotic waveform evaluation |
| AWISPM |
above wafer in situ particle monitoring |
| AWS |
advanced wet station |
| B |
billion; boron |
| Ba |
barium |
| BARC |
bottom antireflective coating |
| BASE |
Boston Area Semiconductor Education (Council) |
| BAW |
bulk acoustic wave |
| BC |
bias contrast |
| BDEV |
behavior-level deviation |
| BDS |
Brownian Dynamics Simulation |
| Be |
beryllium |
| BEOL |
back end of line |
| BESOI |
bonded and etchback silicon on insulator |
| BF |
brightfield |
| BFGS |
Broyden-Fletcher- Goldfarb-Shanno optimization algorithm |
| BFL |
buffered field-effect transistor logic |
| BGA |
ball grid array |
| BHT |
Brinell hardness test |
| Bi |
bismuth |
| BiCMOS |
bipolar complementary metal-oxide semiconductor |
| BIFET |
bipolar field-effect transistor |
| BIM |
binary intensity mask |
| BiMOS |
bipolar metal-oxide semiconductor |
| BIST |
built-in self-test |
| BIT |
bulk ion temperature |
| BITE |
built-in test equipment |
| BMC |
bubble memory controller |
| BMD |
bulk micro defect |
| BOE |
buffered oxide etchant |
| BOR |
bottom of range |
| BOSS |
Book of SEMI Standards; binary object storage system |
| BOX |
buried oxide |
| BPR |
beam profile reflectometry; business process reengineering |
| BPSG |
boron phosphosilicate glass |
| BPTEOS |
BPSG from a TEOS source |
| Br |
bromine |
| BSE |
backscattered electron detection |
| BTAB |
bumped tape automated bonding |
| BV |
breakdown voltage |
| C |
carbon |
| Ca |
calcium |
| CA |
CIM architecture |
| CAA |
CIM applications architecture |
| CAB |
Competitive Analysis Benchmarking |
| CAD |
computer-aided design |
| CADT |
control application development tool |
| CAE |
computer-aided engineering |
| CAI |
computer-assisted instruction |
| CAM |
computer-aided manufacturing |
| CAPS |
computer-assisted problem solving |
| CAR |
chemically amplified resist |
| CARRI |
Computerized Assessment of Relative Risk Impacts |
| CASE |
computer-aided softwareengineering; computer-aided systems engineering |
| CAT |
computer-aided testing |
| CAW |
Construction Analysis Workgroup |
| CAWC |
cryogenic aerosol wafer cleaning |
| CBGA |
ceramic ball grid array |
| CBS |
chemical bottle storage area |
| CBT |
computer-based training |
| CC |
chip carrier; cluster controller |
| CCC |
ceramic chip carrier |
| CCD |
charge-coupled device |