SEZ's Cu BEOL solutions
SEZ工艺">铜工艺后段清洗解决方案
Lienfa Hung, Director of Technology and Marketing, SEZ Asia Pacific
带背面喷嘴的双面卡盘可用于原位正面/斜面聚合物去除；只清洗斜面（BCO）工艺单元适用于正面/斜面聚合物去除和斜面薄膜刻蚀；结合兆声清洗系统可增强聚合物移除工艺的清洗效率。采用低RPM卡盘的更宽工艺窗口适应各种不同反应速率的化学品。
Speaker Bio:
Principal Engineer of Etch department, UMC; Department Manager of Etch Department, SMIC, Current position: Director of Technical Marketing, SEZ AP;
Abstract: