Post Metal & Via Polymer Removal-Challenges and Solutions
后金属和通孔聚合物去除技术的挑战和解决方案
安集微电子（上海）有限公司，彭洪修
·半导体发展过程中有7种光阻清洗液，有溶剂式/氨基化合物式/氟化物式等。
·金属腐蚀是对清洗工艺来说难以解决的挑战性问题，为此需要开发新的清洗液，来实现金属腐蚀的可控制性。
·在碱性条件下，金属腐蚀难以控制；在弱酸性条件下，可以形成钝化层。通过有效的化学添加剂，可以较好的控制金属腐蚀速率。
Libber Peng has been with Anji Microelectronics since September of 2005 as a Senior Development Engineer. Prior to Anji Libber worked at a Chinese foundry as a process Section Manager in the Technol
ogy Development department. He holds a Bachelor of Science in Polymer Materials from Shandong University and a Master in Materials Science from East China University of Science and Technology. Libber is a P.R.C national born in Shandong province and is one of the key team members in the strong technical team at Anji. Libber Peng is married and enjoys traveling and badminton.
Education:
Master, Materials Science, East China University of Science and Technology
B.S., Polymer Materials, Shandong University
Experience:
2005, 9~, Anji Microelectronics (Shanghai) Co., Ltd. Senior Development Manager
2002, 4~2005, 9, SMIC. CMP Section Manager at MTD center.
Born in Shandong Province, China. Like tour, badminton and make friends. Married.
Abstract: The ever increasing requirements for electric performance of on-chip wiring has driven the IC manufactures to several major technological advances in recent years. Copper has replaced Aluminum, as the new interconnect metal of choice. Alternative films for SiO2 with lower dielectric constant are being developed and introduced. For the shrinking device with Aluminum and silicon oxide, shorter processing time and lower processing temperature for the post etch clean of via and metal line are being requested to provide better cleaning efficiency and tighter distribution of via resistance. ATMI and Anji are providing the solutions that are able to meet the major requirements.