Main Columns
Viewpoint
The viewpoints and comments on semiconductor industry trends and
technologies by Semiconductor International editors and industry
experts.
Electronics China
Reports and analysis on developments in China's electronic industry
chain, covering IC design, IP core, system design, manufacturing
and corporate strategies. It also includes a section of news from
SICA (Shanghai Integrated Circuit Association).
China Report
Wide-range reports and interviews on semiconductor manufacturers
and packaging and testing providers in China. It also profiles
semiconductor manufacturing equipment and material suppliers.
Global News
News and interviews on significant events, companies and people
in the global semiconductor manufacturing industry.
Cover Story
Monthly in-depth report on important semiconductor-manufacturing
technologies translated from the English edition of SI.
Processing and Manufacturing
This part of the magazine consists of two sections - Technology
News and Technology Feature. Technology News has following columns
- Emerging Technology, Wafer Processing, Lithography and Yield
Management. The Technology Feature contains insightful analysis
on certain technical issues in semiconductor and FPD manufacturing.
Packaging and Testing
This part is devoted to packaging and testing, addressing mainstream
technologies and discussing issues of wide concern in the industry.
It carries articles by both SI editors as well as those contributed
by companies in the industry. It is a platform for experienced
industrial experts to share their experiences and solutions with
readers.
New Products
Latest news of products and solutions for use in fabs and packaging
houses in short and concise format. “Products Showcase”page highlights
one or two product with larger picture and longer text.
How to make a chip
Written by well-known experts from major manufacturers and vendors
explains on basic concept, principles and knowledge related to
processing, packaging and testing for engineers who are fresh
to the industry.
评论
《半导体国际》资深编辑、技术顾问及业界权威将针对半导体产业与技术的发展趋势发表观点和点评。
电子中国
深入报道和分析中国电子产业链的现状和发展，从IC设计、生产到电子产品整机制造，涉及整个电子行业产业链上下游；通过对上海市集成电路行业协会重要事项的报道，反映管理层对产业发展的导向。
中国报道
全面报道中国半导体制造和封装测试企业的技术新闻、生产与管理以及最新动态，并对全球半导体设备和材料供应商在中国的活动进行采访和报道，定期以专访的形式介绍中国知名半导体公司。
国际新闻
一个国际化的信息平台，聚焦全球半导体行业重大事件、热点新闻，全面整合了Semiconductor International的资源优势。
封面故事
每期杂志将针对半导体制造技术的一个热点主题进行深入的专题报道。
工艺与制造
栏目由技术新闻和专题文章构成。
技术新闻：由前沿技术、晶圆工艺、光刻和成品率管理四个专栏构成， Semiconductor
International资深编辑报道全球半导体制造领域的技术新闻、热点话题和趋势走向。
专题文章：对半导体和平板显示领域中某一技术话题进行深入剖析，为读者提供实用的解决方案、半导体行业和技术发展趋势。
封装与测试
该栏目由关注半导体封装测试的主流技术及其发展方向，同时针对半导体封测工艺的某一技术话题进行深入探讨，与您分享业内资深人士的经验和解决方案。
新产品
发布全球半导体设备及材料供应商最新产品和技术解决方案，其中精品橱窗将是半导体设备和材料供应商全面展示其产品的窗口，每期着重介绍一款产品
基础知识
邀请知名半导体制造和封测公司资深人士撰写，结合实际案例全面介绍半导体制造、封装和测试中涉及的工艺、设备和器件的原理和基础知识，深入浅出，特别针对新加入半导体产业的工程师。